A
Interface control
We author and own the Interface Control Document: the mechanical, electrical, thermal, data, and software standard that separates the platform from the mission system. The OEM builds to it once.
Capabilities
Four capabilities. Each one can be engaged independently.
B
Mission kit integration
We select and manage subsystem suppliers, integrate the kit as a single qualified configuration, and carry integration-level warranty and configuration control at production rate.
C
Vehicle autonomy
We deliver autonomy as a staged program: teleoperation, assisted, supervised, conditional. Each phase fixed-price, gated, and backed by a documented safety framework.
D
Expeditionary manufacturing
We are developing an AI-enabled expeditionary manufacturing architecture — additive manufacturing, 3D scanning, sovereign AI, digital engineering, secure parts libraries, and resilient power — to move manufacturing, repair, and sustainment closer to the point of need.
See the capabilityThe A113 Mission Kit
Eight module classes. Supplier-agnostic. One interface.
01
Edge compute
Ruggedized on-vehicle compute. Disconnected, intermittent, low-bandwidth capable. Hosts all mission software.
02
Mission power
Energy storage and microgrid interface. Silent watch, hot-swap, dynamic load balancing, chemistry-agnostic.
03
Communications
Retractable mast, mesh radio, satellite backhaul, private cellular. Beyond-line-of-sight and contested-spectrum capable.
04
Autonomy & C2
Ground control station and operator interface. Teleoperation through conditional autonomy on one console.
05
Counter-UAS
Passive detection, tracking, and classification. Integrates with existing command systems rather than replacing them.
06
Mission software
Sovereign, air-gapped AI stack under the A113 orchestration layer. No cloud dependency.
07
Signature management
Thermal Deception Field — infrared and radio-frequency deception. Programmable emitters, DRFM transponders, vehicle-mounted and scatterable decoys. A113 proprietary.
See TDF — IR & RF08
Expeditionary manufacturing
AI-enabled manufacturing, repair, and sustainment at the point of need: additive manufacturing, 3D scanning and reverse engineering, secure digital parts libraries, inspection, and resilient power.
See the capabilityModules are optional. The interface is not.
Any module may be added, removed, or re-sourced without re-qualifying the platform.
Platform anatomy
Modular. Supplier-agnostic. One interface.
A
Sensor pod
Counter-UAS, EO/IR, GNSS.
B
Retractable mast
Mesh, SATCOM, private cellular.
C
Edge compute bay
Ruggedized on-vehicle compute & mission software.
D
Energy storage
Microgrid interface, silent watch, hot-swap.
E
Signature management
Thermal Deception Field (IR/RF). Vehicle-mounted & scatterable.
Delivery model
We don't sell components. We deliver mission capability.
Fixed-price
No cost escalation.
Milestone-billed
Clear outcomes.
Phase-gated
Earn the next phase.
Integration warranty
We stand behind it.
Next step
Start with a scoping study
Six to eight weeks, fixed price. You receive the concept of operations, the Interface Control Document, the electrical and thermal budget against your actual platform, a safety framework, and a firm price for the build.
If the study does not earn the next phase, you have learned that for the cost of a study.
Request a scoping study